The "Immersion White Tin" process can be used as a DIRECT REPLACEMENT of the hot air solder leveling process. It will cover active copper surfaces with a very dense white tin that retains its solderability in excess of one year. The key to the process is the type and structure of the deposit. It is a fine crystalline structure that is non-porous. This process should not be confused with conventional "gray immersion tin" coatings that should only be used for cosmetic enhancement.

The process will ALWAYS produce a flat solderable surface that is desirable for surface mount components. Uneven thickness on solder pads or in holes are ELIMINATED. The coating is uniform over the ENTIRE copper area.

• Lowest assembly process costs
• Ability to withstand multiple soldering operations
• Easy and accurate mounting of fine pitch surface mount devices and ball grid arrays
• Compatibility with low activity and no-clean fluxes